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Abstract:

This video features an interview with Nitin, a product marketing representative from Qualcomm, introducing the Snapdragon X55 5G modem at a tradeshow, likely MWC. The discussion focuses on the X55's technical advantages over its predecessor, the X50. Key improvements include its 7nm manufacturing process, single-chip integration of 2G through 5G connectivity, and added support for FDD and standalone (SA) 5G modes. These new capabilities, particularly FDD support, are presented as critical for accelerating 5G deployment with global operators using existing 4G spectrum. The representative also confirms a commercial launch timeline for X55-equipped devices in the second half of 2019, discusses a separate forthcoming integrated 5G System-on-a-Chip (SOC), and briefly touches on infrastructure topics like millimeter-wave bandwidth and small cells.

Qualcomm's Snapdragon X55: A Closer Look at the Next-Gen 5G Modem

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